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Avoid micro-cracks with patented HeatCap™ technology from WINAICO

WINAICO HeatCap™ Solar Cell
Taiwan Excellent PV Award 2014

As the efficiency of solar cells improves, the wafers get thinner – especially for high-end solar cells. This means that the fragility of the solar cell becomes an issue for the industry. Furthermore are transportation, installation of the panels, as well as the operation of the system itself, causing a constant vibration. This causes cracks, and when water penetrates into those cracks, it reduces the conductivity of cells, causing the power to drop.

This latest innovation from WINAICO increases the mechanical strength of silicon solar cells by up to 18.12%. This result was demonstrated at Taiwan’s leading research institute ITRI, which verified the reliability of HeatCap™ technology in dynamic mechanical loads (DML) and selective thermal loads (hotspots). With 1,000 DML test cycles at 1,000 Pa, 2,000 Pa and 3,000 Pa and a subsequent electroluminescence test the significant distance from the reference modules was shown. The positive results in the hotspot test are based on the improved heat dissipation of HeatCap™ technology and enable the output of pure black modules to be increased even in warmer application environments.

  • Increases mechanical strength by up to 18.12%
  • Improved heat dissipation allows for higher output from pure black modules
  • Avoids hotspot damage thanks to patented HeatCap™ technology from WINAICO

The Taiwan Excellent PV Award of the Bureau of Energy acknowledges the outstanding quality of the pure black module, which has been designed especially for residential homes, where it enhances the appearance of roofs.

WINAICO WSP-M6 PERC

Cell Strength Analysis

The results of the investigation show HeatCap™ can improve the strength of solar cells up to 18.12%.

Dynamic Mechanical Load Analysis

ITRI executed DML tests of HeatCap™ modules and reference modules up to 3000 Pa to prove HeatCap™'s micro-crack suppression capability. EL pictures taken after each stage shows HeatCap™ modules can reduce the appearance of micro-cracks under mechanical stresses.

Hot Spot Reduction Analysis

ITRI's local hot spot tests simulated the appearance of hot spots caused by field defects. The HeatCap™ cell was more than 7°C cooler than the normal solar cell due to better heat conduction of HeatCap™ technology, improving reliability against hot spots.